Somos GP Plus 14122 EN Data Sheet 1.pdf
® ™ Somos GP Plus 14122
Stereolithography
A universal stereolithography material designed to produce accurate, detailed parts across a wide range of applications.
® Somos GP Plus 14122 sets the standard for 3D printing prototypes. It is easily integrated in production cycles to test designs ensuring proper functionality of parts before they are launched into full production – providing customers the opportunity to get to market quickly. Parts ® produced with Somos GP Plus 14122 are durable, accurate and moisture resistant. This material is ideal for functional prototypes, concept models and low volume production parts.
Key Benefits
• Extremely accurate
• Excellent humidity resistance
• Very durable
Ideal Applications
• Aerospace parts
• Automotive parts
• Consumer product parts
• Low volume production parts
| LIQUID PROPERTIES | OPTICAL PROPERTIES | |||
|---|---|---|---|---|
| Appearance | Opaque White | $E_{C}$ | 13mJ/cm^{2}$ | [critical exposure] |
| Viscosity | ~340 cps@30℃ | D_{P}$ | 6.25 mils | [slope of cure-depth vs.In(E) curve] |
| Density | ~1.16g/cm^{3}@25℃ | E_{10}$ | 64mJ/cm^{2}$ | [exposure that gives 0.254mm(.010inch) thickness] |
$$ \mathsf{E}_{\mathrm{c}} $$
$$ \mathrm{D_{p}} $$
$$ \mathrm{E}_{10} $$
Data Sheet
| MECHANICAL PROPERTIES | UV POSTCURE | ||
|---|---|---|---|
| ASTM Method | Property Description | Metric | Imperial |
| D638M | Tensile Modulus | 2,510MPa | 364ksi |
| D638M | Tensile Strength | 37MPa | 5.4ksi |
| D638M | Elongation at Break | 7.5% | |
| D638M | Elongation at Yield | 3% | |
| D790M | Flexural Strength | 67.3MPa | 9.8ksi |
| D2240 | Flexural Modulus | 2,200MPa | 319ksi |
| D256A | Izod Impact(Notched) | 26J/m | 0.49ft-lb/in |
| D638M | Poisson's Ratio | 0.37% | |
| D2240 | Hardness(Shore D) | 79 | |
| D570-98 | Water Absorption | 0.4% |
| THERMAL/ELECTRICAL PROPERTIES | UV POSTCURE | ||
|---|---|---|---|
| ASTM Method | Property Description | Metric | Imperial |
| E831-05 | C.T.E. -40-0℃(-40-32F) | 63μm/m℃ | 35μin/in°F |
| E831-05 | C.T.E. 0-50℃(32-122F) | 89μm/m℃ | 49μin/in°F |
| E831-05 | C.T.E. 50-100℃(122-212F) | 170μm/m℃ | 95μin/in°F |
| E831-05 | C.T.E. 100-150℃(212-302F) | 172μm/m℃ | 96μin/in°F |
| D150-98 | Dielectric Constant 60Hz | 3.8 | |
| D150-98 | Dielectric Constant 1KHz | 3.7 | |
| D150-98 | Dielectric Constant 1MHz | 3.4 | |
| D149-97A | Dielectric Strength | 17.9kV/mm | 454V/mil |
| D648 | HDT@0.46MPa(66psi) | 46℃ | 115F |
| D648 | HDT@1.81MPa(264psi) | 41℃ | 106F |
These values may vary and depend on individual machine processing and post-curing practices.